1. A METHOD FOR FORMING ELECTRICAL CONNECTIONS BETWEEN METALLIC SURFACES COMPRISING THE STEPS OF SUBJECTING SAID SURFACES TO THE ACTION OF A SOLUTION CONSISTING ESSENTIALLY OF A RESIN, A DILUENT AND AN ACID REACTIVE WITH ANY OXIDE COATING FORMED THEREON TO EXPOSE CLEAN METALLIC SURFACES, SAID CLEAN METALLIC SURFACES CAPABLE OF FOROMING CONDUCTIVE METALLIC BONDS WHEN CONTACTED SO AS TO DEFINE AN ELECTRICAL CONNECTION, AND CONTACTING SAID EXPOSED METALLIC SURFACES TO ESTABLISH AN ELECTRICAL CONNECTION THEREBETWEEN, SAID RESIN HARDENING UPON EVAPORATION OF THE UNREACTED ACID TO FORM A BINDER TO MAINTAIN SAID METALLIC SURFACES IN CONTACT.