Magnetic resin mold lead relay |
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| 申请号 | JP12551389 | 申请日 | 1989-05-18 | 公开(公告)号 | JPH02304834A | 公开(公告)日 | 1990-12-18 |
| 申请人 | Sony Corp; | 发明人 | KONNO AKIRA; | ||||
| 摘要 | PURPOSE: To improve mass productivity, uniformalize and stabilize operating characteristics, improve freedom for selecting characteristics and enable employment of a heat sensitive relay structure by composing a magnetic resin mold of a multi-color magnetic resin plastic consisting of a soft magnetic resin mold and magnetized hard magnetic resin mold. CONSTITUTION: A magnetic resin mold 5 comprises a multi-color magnetic resin mold of a soft magnetic resin mold 5A and a magnetized hard magnetic resin mold 5B. With this constitution, molding is done with necessity of using a specific case eliminated to improve mass productivity. Since the entire mold 5 is magnetic, a relay coil having desired operating characteristics can be correctly and uniformly obtained after lead relay assembly. Further by appropriately selecting Curie temperature of the soft magnetic resin mold 5A, a heat sensitive lead relay can be also structured. Thus mass productivity can be improved and desired operating characteristics can be correctly uniformed and stabilized while also a heat sensitive lead relay can be also structured. COPYRIGHT: (C)1990,JPO&Japio |
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