Front panel overlay incorporating a logic circuit |
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| 申请号 | US13765418 | 申请日 | 2013-02-12 | 公开(公告)号 | US09996173B2 | 公开(公告)日 | 2018-06-12 |
| 申请人 | Illinois Tool Works, Inc.; | 发明人 | John H. Schneider; William A. Herring; Daniel W. Johnston; | ||||
| 摘要 | A front panel overlay having a plurality of layers and one or more logic circuits incorporated therein is disclosed. One of the plurality of layers may have a first electrical contact and another one of the plurality of layers may have a second electrical contact. The one or more logic circuits may be incorporated at least indirectly within the plurality of layers and may be activated when the first electrical contact completes an electrical circuit with the second electrical contact. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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