Method for mounting an electronic component on a wiring substrate and an illuminated switch unit using this mounting method |
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| 申请号 | EP96304049.8 | 申请日 | 1996-06-04 | 公开(公告)号 | EP0748152A3 | 公开(公告)日 | 1998-02-25 |
| 申请人 | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; | 发明人 | Sera, Naoki; Mitsuoka, Hideki; Sano, Yoshiro; Nasu, Tetsutaro; | ||||
| 摘要 | An insulating film 3 is provided with an opening 4 whose size is equivalent to or slightly smaller than the outer configuration of electronic component 5. A conductive pattern 2 is formed on insulating substrate 1. After forcibly inserting the main body of electronic component 5 into said opening 4, terminals 6 are put between insulating film 3 and insulating substrate 1 and disposed in such a manner that terminals 6 are brought into contact with conductive pattern 2. Then, insulating film 3 is connected with insulating substrate 1 by soldering them in a region surrounding terminals 6, thereby firmly fixing terminals 6 of electronic component 5 on conductive pattern 2. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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