Potentiometer contact springs |
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| 申请号 | US3755892D | 申请日 | 1972-05-10 | 公开(公告)号 | US3755892A | 公开(公告)日 | 1973-09-04 |
| 申请人 | DIETERICH F; | 发明人 | DIETERICH F; | ||||
| 摘要 | A method of manufacturing miniature potentiometer contact springs by winding a substantial length coil of a single layer of fine, heat-treatable precious metal alloy wire on a generally cylindrical form, masking spaced strips longitudinally of the wire coil, plating the wire coil between the masked strips, removing the strips and cutting the strip-plated wire band from the mandrel as a sheet, cutting the wire sheet to produce contact strip blanks of various forms severable into individual contacts. A multi-layer masking system is used to photographically define the spaced strips. An adherent support about the wire coil permits the coil to be removed before masking and processed in sheet form. Contact springs using wire of a reduced lateral diameter are produced by flattening the wire prior to winding on the form. | ||||||
| 权利要求 | 1. The method of forming a spring contact including the steps of: winding a coil layer of wire on a form; applying a non-conducting mask to said coil except for longitudinally extending, circumferentially spaced bare strips thereof; depositing continuous strips of high conductivity metal on said bare strips of said coil; cutting said coil longitudinally and removing it from the form in the form of a sheet; and forming one or more contact strip blanks from said sheet, said blanks comprising a plurality of side-by-side wire fingers joined by one or more continuous strips of said metal. 2. The method defined in claim 1, including: removing said non-conducting mask. 3. The method defined in claim 1, including: removing said non-conducting mask at a time subsequent to said step of cutting and removing said coil. 4. The method defined in claim 1, wherein said step of forming includes cutting said sheet parallel to said wire fingers. 5. The method defined in claim 1, wherein said step of forming includes cutting said sheet perpendicular to said wire fingers. 6. The method defined in claim 1, wherein said step of forming includes cutting said sheet parallel to said wire fingers to form a contact strip blank of end-to-end connected spring contacts. 7. The method defined in claim 6, wherein said step of forming includes cutting said strip perpendicular to said wire fingers. 8. The method defined in claim 7, wherein said cutting of said strip perpendicular to said wire fingers is along lines bisecting both said metal strips and the spacing between said strips. 9. The method defined in claim 1, wherein said step of applying a non-conducting mask includes applying a resist to said coil and removing the resist to define said longitudinally extending, circumferentially spaced bare strips of said coil. 10. The method defined in claim 9, wherein said step of applying a non-conducting mask includes applying a photosensitive resist to said coil, and exposing and developing said resist in a pattern to define said longitudinally extending strips. 11. The method defined in claim 10, wherein said photosensitive resist is applied with a protective layer thereon. 12. The method defined in claim 11, wherein said step of applying a non-conductive mask includes positioning a negative about said resist, said pattern being defined by said negative. 13. The method defined in claim 12, wherein said step of positioning a negative includes wrapping and securing said negative about said resist. 14. The method defined in claim 12, wherein said step of positioning a negative includes depositing a negative image on said protective layer. 15. The method defined in claim 14, wherein said negative image is deposited by silk-screening. 16. The method defined in claim 12, wherein said step of positioning a negative includes applying a photosensitive emulsion to said protective layer, and exposing and developing said emulsion to form a negative image thereon. 17. The method defined in claim 16, wherein said emulSion is sensitive to and is exposed with light of a wavelength to which said resist is insensitive. 18. The method defined in claim 1, including: forming ends of said wire fingers to provide radius points of contact thereon. 19. The method defined in claim 1, including: heat-treating said fingers to provide spring characteristics therefor. 20. The method defined in claim 1, wherein said step of depositing includes plating a metal from the group including silver, copper, and nickel. 21. The method defined in claim 1, including: flattening said wire prior to winding on said form to provide a barrel cross-section thereto with a reduced height between opposing sides of said wire; and winding said wire with the direction of said height extending longitudinally of said coil. 22. The method defined in claim 1, wherein said step of cutting precedes the steps of applying a non-conducting mask and depositing continuous strips. 23. The method defined in claim 22, including: the step of applying an adherent support to said coil prior to said step of cutting wherein said step of cutting and removing said coil in the form of a sheet exposes the originally interior coil wire surface in sheet fashion for subsequent processing steps. 24. The method defined in claim 23, including: the step of removing said adherent support at a point subsequent to said step of depositing continuous strips. 25. The method defined in claim 23, wherein the step of applying an adherent support includes wrapping an adhesive tape around said coil spanning the wire turns of said coil. 26. The method defined in claim 23, wherein the step of applying an adherent support includes coating said wire coil with a lacquer layer. 27. The method defined in claim 23, wherein said step of applying a non-conducting mask includes applying a photosensitive resist to said wire surface, and exposing and developing said resist in a pattern to define said longitudinally extending strips. 28. The method defined in claim 27, wherein said photosensitive resist is applied with a protective layer thereon. 29. The method defined in claim 28, wherein said step of applying a non-conductive mask includes positioning a negative adjacent said resist, said pattern being defined by said negative. 30. The method defined in claim 29, wherein said step of positioning a negative includes depositing a negative image on said protective layer. 31. The method defined in claim 30, wherein said negative image is deposited by silk-screening. 32. The method defined in claim 29, wherein said step of positioning a negative includes applying a photosensitive emulsion to said protective layer, and exposing and developing said emulsion to form a negative image thereon. 33. The method defined in claim 32, wherein said emulsion is sensitive to and is exposed with light of a wavelength to which said resist is insensitive. 34. The method defined in claim 23, including: forming ends of said wire fingers to provide radius points of contact thereon. 35. The method defined in claim 23, including: heat-treating said fingers to provide spring characteristics therefor. 36. The method defined in claim 23, including: flattening said wire prior to winding on said form to provide a barrel cross-section thereto with a reduced height between opposing sides of said wire; and winding said wire with the direction of said height extending longitudinally of said coil. 37. The method defined in claim 1, wherein said steps of applying a non-conducting mask to said coil and depositing continuous strips are performed on both interior and exterior surfaces of said coil. |
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