Vacuum switch chamber forming method |
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| 申请号 | JP24900090 | 申请日 | 1990-09-20 | 公开(公告)号 | JPH03119618A | 公开(公告)日 | 1991-05-22 |
| 申请人 | Calor Emag Elektrizitaets Ag; Degussa Ag; | 发明人 | GIYUNTAA PIRUJINGAA; YOOZEFU RITSUPERUTSU; BORUFUGANKU DEIIMU; | ||||
| 摘要 | PURPOSE: To accurately set a brazing and soldering spacer and keep the position during assembly work by tightly attaching or welding the brazing and soldering spacer to a brazing and soldering plate. CONSTITUTION: A brazing and soldering spacer 12 is attached tightly or welded to a brazing and soldering plate 14. For example, two members the brazing spacer 12 and the brazing plate 14 are integrated by tightly bonding to each other. In this case, the bonding they are spot-welded on each member by means of laser pulse. The brazing and soldering spacer 12 is formed on a ring 12a of a brazing and soldering wire. The ring 12a in any case is arranged around the boss 16, which is emboss-processed on the brazing and soldering plate 14. COPYRIGHT: (C)1991,JPO |
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| 说明书全文 | |||||||
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