Thermoplastic resin composition for electrical/electronic contact part and electrical/electronic contact part using the same |
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| 申请号 | EP95120613 | 申请日 | 1995-12-27 | 公开(公告)号 | EP0728816A3 | 公开(公告)日 | 1998-08-05 |
| 申请人 | OMRON TATEISI ELECTRONICS CO; MITSUBISHI ENG PLASTICS CORP; | 发明人 | TAKENAKA YUTAKA; FUNAKI KENJI; FURUYA TOSHIYUKI; MURAMATSU SHIGERU; KANAZAWA YOSHITAKA; KIMURA OSAMU; | ||||
| 摘要 | A thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes a thermoplastic resin and a polyol, wherein the polyol is contained in a range of 0.2 to 10 parts by weight based on 100 parts by weight of the thermoplastic resin. Alternatively, a thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes: a thermoplastic resin; a halogenated aromatic compound which is contained in a range of 1 to 50 parts by weight based on 100 parts by weight of the thermoplastic resin; and a double salt represented by at least one of (X2O)n•Sb2O5 and (YO)n•Sb2O5, where X represents a monovalent alkaline metal element, and Y represents a divalent alkaline earth metal element, and n represents a ratio of X2O or YO to Sb2O5 exceeding 0.7, the double salt having an adsorbed water elimination rate of not more than 50 min. as calculated in terms of titration time; or a polyol; wherein the double salt is contained in a range of 0.5 to 40 parts by weight based on 100 parts by weight of the thermoplastic resin. | ||||||
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