Chip component and method of producing the same |
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| 申请号 | US15271882 | 申请日 | 2016-09-21 | 公开(公告)号 | US09972427B2 | 公开(公告)日 | 2018-05-15 |
| 申请人 | ROHM CO., LTD.; | 发明人 | Yasuhiro Kondo; Hiroshi Tamagawa; Hiroki Yamamoto; | ||||
| 摘要 | A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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