AQUEOUS BONDING COMPOSITION |
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| 申请号 | US15883185 | 申请日 | 2018-01-30 | 公开(公告)号 | US20180155583A1 | 公开(公告)日 | 2018-06-07 |
| 申请人 | HENKEL AG & CO. KGAA; | 发明人 | Atsushi KAKUDA; Yoshio YOSHIDA; | ||||
| 摘要 | Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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