PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM专利检索- 本小类中所包括的化合物制备的一般工艺过程专利检索查询-专利查询网

PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM
申请号	PCT/JP2004015870	申请日	2004-10-20	公开(公告)号	WO2005044899A8	公开(公告)日	2005-06-30
申请人	DAICEL CHEM; TAKARAGI AKIRA; FUNAKI YOSHINORI; HASHIMOTO JIICHIRO;			发明人	TAKARAGI AKIRA; FUNAKI YOSHINORI; HASHIMOTO JIICHIRO;
摘要	A prepolymer, characterized in that it is prepared by the reaction of two compounds A and B which have two or more functional moieties or two or more groups of functional moieties, respectively, and are capable of undergoing a polymerization through the bonding of a functional moiety or a group of functional moieties of one compound with a functional moiety or a group of functional moieties of the other compound to form a high molecular weight polymer having a structure containing a hole. The prepolymer has a weight average molecular weight of ca. 200 to 100000. In a preferred embodiment, the compound A has a carboxyl moiety or an amino moiety as the above functional moiety or a group of functional moieties, and the compound B has two amino moieties, an amino moiety and a hydroxyl moiety, an amino moiety and a mercapto moiety, or two carboxyl moieties as the above functional moiety or a group of functional moieties.
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