| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 241 | Detection of defective electrical connections | US13862437 | 2013-04-14 | US09664728B2 | 2017-05-30 | Franz Jost; Jens Barrenscheen; Philip Georg Brockerhoff |
| An embodiment relates to an integrated circuit comprising at least two electrical connections and at least one coil arranged adjacent to at least one of the electrical connection, wherein the at least one coil each comprises at least one winding and wherein the at least one coil is arranged on or in the integrated circuit. | ||||||
| 242 | Semiconductor device | US14223149 | 2014-03-24 | US09627571B2 | 2017-04-18 | Naoto Kaguchi; Yoichiro Tarui |
| An optical fiber is provided between a photodiode and a semiconductor active portion of a wide gap semiconductor element forming portion such that emitted light at the time of light emission of the semiconductor active portion of the wide gap semiconductor element forming portion is incident from an incident surface of the optical fiber, and is received from an emitting surface to the photodiode through the optical fiber. Specifically, the incident surface of the optical fiber is arranged so as to be opposed to a side surface portion of the wide gap semiconductor element forming portion, so that the emitted light at the time of light emission of the wide gap semiconductor element is incident on the incident surface. | ||||||
| 243 | Method and system for monitoring speaker temperature for speaker protection | US14732498 | 2015-06-05 | US09609450B2 | 2017-03-28 | David T. Yeh |
| A method of monitoring speaker temperature for speaker protection starts by generating a low level inaudible noise signal and injecting the low level inaudible noise signal in an audio signal. The voice coil resistance estimate that estimates a resistance of a voice coil of a speaker is then computed. The voice coil resistance estimate changes while the speaker is being driven by the audio signal that includes the low level inaudible noise signal. The temperature estimate is then computed based on the voice coil resistance estimate. The level of the audio signal may be adjusted based on the temperature estimate. Other embodiments are also described. | ||||||
| 244 | Calculation of MOSFET switch temperature in motor control | US14853627 | 2015-09-14 | US09608558B1 | 2017-03-28 | Christian Heiling; Matthias Bogus |
| Systems and techniques are described for monitoring the operating temperature of one or more circuit elements, such as a metal oxide field effect transistor (MOSFET) switch, where the circuit element is used to control at least one phase of an electric motor. The systems and techniques may calculate temperature by determining at least two electrical signals from the circuit element taken at least two different times. This results in an accurate temperature calculation without requiring precise knowledge of the particular characteristics of each respective circuit element. | ||||||
| 245 | CALCULATION OF MOSFET SWITCH TEMPERATURE IN MOTOR CONTROL | US14853627 | 2015-09-14 | US20170077862A1 | 2017-03-16 | Christian Heiling; Matthias Bogus |
| Systems and techniques are described for monitoring the operating temperature of one or more circuit elements, such as a metal oxide field effect transistor (MOSFET) switch, where the circuit element is used to control at least one phase of an electric motor. The systems and techniques may calculate temperature by determining at least two electrical signals from the circuit element taken at least two different times. This results in an accurate temperature calculation without requiring precise knowledge of the particular characteristics of each respective circuit element. | ||||||
| 246 | Estimation of resistance in electrical machines | US14095961 | 2013-12-03 | US09575104B2 | 2017-02-21 | Michael James Turner |
| In an electrical machine which has unidirectional excitation applied to its windings, the mean values of voltage and current can be computed from the instantaneous phase voltage and current by the use of, for example, low-pass filters (in either the analogue or digital domain). The value of winding resistance can then be calculated by dividing the mean voltage by the mean current. This avoids the cost, fragility and potential inaccuracy of conventional temperature sensors, and provides the controller with an ongoing estimate of winding temperature. | ||||||
| 247 | TEMPERATURE SENSING | US15209852 | 2016-07-14 | US20170026767A1 | 2017-01-26 | Christophe Macours; Jan Paulus Freerk Huijser; Shawn Scarlett |
| A circuit and method for determining an ambient temperature for an electronic device having a loudspeaker are described. An amplifier drives the loudspeaker and first circuitry is configure to determine an overall temperature of the loudspeaker or the amplifier. Second circuitry is configured to determine a change in temperature of the loudspeaker or the amplifier resulting from power dissipated in the loudspeaker or the amplifier. Third circuitry is configured to subtract a signal representative of the change in temperature from a signal representative of the overall temperature and output a signal representative of the ambient temperature for the electronic device. | ||||||
| 248 | METHOD AND SYSTEM FOR MONITORING SPEAKER TEMPERATURE FOR SPEAKER PROTECTION | US14732498 | 2015-06-05 | US20160360331A1 | 2016-12-08 | David T. Yeh |
| A method of monitoring speaker temperature for speaker protection starts by generating a low level inaudible noise signal and injecting the low level inaudible noise signal in an audio signal. The voice coil resistance estimate that estimates a resistance of a voice coil of a speaker is then computed. The voice coil resistance estimate changes while the speaker is being driven by the audio signal that includes the low level inaudible noise signal. The temperature estimate is then computed based on the voice coil resistance estimate. The level of the audio signal may be adjusted based on the temperature estimate. Other embodiments are also described. | ||||||
| 249 | ENERGIZING AND MEASURING THE TEMPERATURE OF STATOR WINDINGS IN AN AT LEAST MOTOR-DRIVEN ELECTRIC POLYPHASE MACHINE | US15110201 | 2014-12-11 | US20160334281A1 | 2016-11-17 | Manuel Hoellmann |
| A method for energizing the stator windings of a rotating field machine operable in motor mode, the stator windings respectively being impinged upon with phase currents that are predefined using a vector-based method. The phase currents are impinged upon at least in part with bias currents that are determined by the vector-based method in such a way that they exhibit no torque effectiveness in the rotating field machine. | ||||||
| 250 | Control apparatus for a diesel exhaust fluid injector | US14447313 | 2014-07-30 | US09458748B2 | 2016-10-04 | Giovanni David; Raffaello Ardanese |
| A control apparatus is disclosed for a diesel exhaust fluid injector located in an exhaust pipe of a diesel internal combustion engine. The control apparatus includes an electronic control unit configured to: energize a solenoid of the injector to perform a diesel exhaust fluid injection; determine an electric voltage value indicative of the electric voltage applied to the injector solenoid during the diesel exhaust fluid injection; determine an electric current value indicative of the electric current flowing through the injector solenoid during the diesel exhaust fluid injection; calculate an electric resistance value of the injector solenoid as a function of the determined electric voltage value and the electric current value; and estimate an injector temperature value as a function of the calculated electric resistance value. | ||||||
| 251 | Power semiconductor device, manufacturing method therefor, and method for operating the power semiconductor device | US14303654 | 2014-06-13 | US09450019B2 | 2016-09-20 | Christoph Kadow; Marc Strasser |
| A power semiconductor device includes a semiconductor body including a first surface, an edge delimiting the semiconductor body in a horizontal direction substantially parallel to the first surface, an active area including at least one of several transistor structures connected in parallel and several diode structures connected in parallel, and a peripheral area arranged between the active area and the edge. The power semiconductor further device includes a plurality of word lines, a plurality of bit lines separated from the word lines, and a plurality of temperature sensors arranged on or at the first surface, wherein each of the temperature sensors is connected with one of the bit lines and one of the word lines or each of the temperature sensors is formed by a respective portion of one of the bit lines. | ||||||
| 252 | ENERGY GENERATING DEVICE USING TEMPERATURE VARIATION AND SENSOR FOR DETECTING TEMPERATURE VARIATION COMPRISING THE SAME | US15002694 | 2016-01-21 | US20160211777A1 | 2016-07-21 | Sang-Woo KIM; Sung Soo KWAK; Tae Yun KIM; Tae-Ho KIM; Wanchul SEUNG; Hanjun RYU; Hong-Joon YOON; Ju Hyuck LEE |
| An energy generating device includes first material portions comprising a first material, wherein the first material is a piezoelectric material; second material portions comprising a second material, wherein the second material has a larger coefficient of thermal expansion than the first material; lower electrodes; and upper electrodes, wherein second material portions are spaced apart from one another, the first material portions are disposed in a space between the second material portions and in contact with the second material portion, and each of the lower electrodes and upper electrodes are disposed below and above, respectively, each of the first material portions. | ||||||
| 253 | Method and device for the welding of pipes | US13978337 | 2011-12-30 | US09383052B2 | 2016-07-05 | Kjell Lidström |
| Pipes of a weldable polymer material are welded with a muff of a weldable polymer material. The method includes placing the muff with an overlap over the ends of the pipes, welding the muff to the ends of the pipes through placement of an electrically conducting band that is permeable to molten plastic between the pipe and the muff, connecting a power supply to the band through feed cables, and supplying an electrical current in order to heat the band and the surrounding polymer material such that they melt together around the band in order to form a weld. The temperature of the weld is calculated through adding the initial ambient temperature of the weld and the increase in temperature of the band. | ||||||
| 254 | Matrix thermal sensing circuit and heat dissipation system | US14144506 | 2013-12-30 | US09310255B2 | 2016-04-12 | Chung-Wei Kuo; Kuo-Chen Huang; Kuan-Kun Tang |
| A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively. | ||||||
| 255 | POWER DEVICE TEMPERATURE MONITOR | US14880866 | 2015-10-12 | US20160033339A1 | 2016-02-04 | Yifan Tang |
| A power device temperature monitor is provided. The power device temperature monitor includes a power device having a control terminal and an output terminal, where the output terminal is configured to output a current as directed by a voltage of the control terminal. The power device temperature monitor includes an inductor coupled to the output terminal of the power device and an amplifier coupled to the inductor. The power device temperature monitor includes a computing device that receives an output of the amplifier, the computing device is configured to derive a temperature of the power device based upon the output of the amplifier. | ||||||
| 256 | Power Semiconductor Device, Manufacturing Method Therefor, and Method for Operating the Power Semiconductor Device | US14303654 | 2014-06-13 | US20150364524A1 | 2015-12-17 | Christoph Kadow; Marc Strasser |
| A power semiconductor device includes a semiconductor body including a first surface, an edge delimiting the semiconductor body in a horizontal direction substantially parallel to the first surface, an active area including at least one of several transistor structures connected in parallel and several diode structures connected in parallel, and a peripheral area arranged between the active area and the edge. The power semiconductor further device includes a plurality of word lines, a plurality of bit lines separated from the word lines, and a plurality of temperature sensors arranged on or at the first surface, wherein each of the temperature sensors is connected with one of the bit lines and one of the word lines or each of the temperature sensors is formed by a respective portion of one of the bit lines. | ||||||
| 257 | On-chip temperature sensor using interconnect metal | US13561711 | 2012-07-30 | US09200968B2 | 2015-12-01 | Michael Coln; Alain Valentin Guery; Lejun Hu |
| An accurate, cost-efficient temperature sensor may be integrated into an integrated circuit (IC) using common materials as the IC's interconnect metallization. The temperature sensor may include an impedance element having a length of metal made of the interconnect metal, a current source connected between a first set of contacts at opposite ends of the impedance element, and an analog-to-digital converter connected between a second set of contacts at opposite ends of the impedance element. The temperature sensor may exploits the proportional relationship between the metal's resistance and temperature to measure ambient temperature. Alternatively, such a temperature sensor may be used on disposable chemical sensors where the impedance element is made of a common metal as conductors that connect a sensor reactant to sensor contacts. In either case, because the impedance element is formed of a common metal as other interconnect, it is expected to incur low manufacturing costs. | ||||||
| 258 | Method and device for remote sensing and control of LED lights | US14177673 | 2014-02-11 | US09161415B2 | 2015-10-13 | Anthony Catalano; Daniel Harrison |
| A control system is disclosed for determining an actual temperature of a light emitting diode. The control system uses conductor that supply power to the light emitting diode to supply a pulse to the light emitting diode. The pulse is determined along with a reaction caused by the pulse and the information gained is used in determination of the light emitting diode die temperature which can then be used in controlling current to the light emitting diode to control the temperature of the light emitting diode. | ||||||
| 259 | BEARING ARRANGEMENT AND METHOD FOR DETERMINING THE LOAD ZONE OF A BEARING | US14428943 | 2012-09-19 | US20150247529A1 | 2015-09-03 | Hans-Henning Klos; Jürgen Schimmer |
| A bearing, supporting a movable component in relation to a stationary component, and a detection device are included in a bearing arrangement. The bearing arrangement also includes at least two temperature sensors for respective detection of temperature. The detection device detects a load zone of the bearing, formed by an area of the bearing in which, during a movement of the movable component, a higher mechanical loading occurs in the bearing compared to an adjacent area. The detection device determines the load zone of the bearing by using the detected temperatures. | ||||||
| 260 | Systems and methods for measuring ambient and laser temperature in heat assisted magnetic recording | US13827089 | 2013-03-14 | US09074941B1 | 2015-07-07 | Alexander Krichevsky; Robert J. Johnson |
| Systems and methods for measuring ambient and laser temperature in heat assisted magnetic recording (HAMR) systems are provided. One such system includes a slider having a write head, a laser diode coupled to the slider and configured to direct energy to a magnetic medium, and a preamplifier circuit including a voltage measurement circuit configured to measure a voltage drop across the laser diode, and a current measurement circuit configured to measure a current through the laser diode, where the preamplifier circuit is configured to store calibration information including a plurality of temperatures corresponding with measurements of the voltage drop across the laser diode and measurements of the current through the laser diode, and calculate a temperature based on the measured voltage drop across the laser diode, the measured current through the laser diode, and the calibration information. | ||||||
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