专利汇可以提供Preparation of substrate for electroless deposition专利检索,专利查询,专利分析的服务。并且An improved process is provided for preparing a substrate to receive a metal coating (e.g. copper) over a selected area of its surface by electroless deposition. A substrate is provided with areas of divergent surface characteristics with respect to the retention of a colloidal material, and a coating of a colloidal material is applied to the same which is subsequently subjected to a destabilizing medium (i.e. a stripper) for a time sufficient to substantially remove the colloidal material from those areas in which no electroless deposition is desired. For example, the colloidal material may be (1) a colloidal stannous salt (e.g. stannous chloride), or (2) a colloidal noble metal applied from bath containing a stannous salt (e.g. stannous chloride) and a noble metal salt (e.g. palladium chloride). In (1) a noble metal salt is subsequently contacted with the colloidal coating of stannous salt and is reduced to a colloidal noble metal. The colloidal noble metal at selected areas of the surface of the substrate is catalytic to the deposition of the metal to be deposited electrolessly. Suitably destabilizing media for the removal of a portion of the colloidal material from the surface of the substrate include solutions of strong electrolytes (e.g. basic lead carbonate, ferric chloride, and aluminum sulfate). When the colloidal material is a colloidal noble metal applied from a bath containing both a stannous salt and a noble metal salt, the particularly preferred destabilizer is an organic compound which is capable of removing the noble metal (e.g. palladium). The present process is particularly suited for preparing a substrate, such as a printed circuit card, having through holes so that the walls of the holes as well as other predetermined areas may selectively receive a metal coating by electroless deposition.,下面是Preparation of substrate for electroless deposition专利的具体信息内容。
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