Method of manufacturing piezoelectric resonators for controlling the coupling coefficient thereof专利检索-压电谐振器电子零件及设备专利检索查询-专利查询网

Method of manufacturing piezoelectric resonators for controlling the coupling coefficient thereof

阅读：409发布：2023-03-21

专利汇可以提供Method of manufacturing piezoelectric resonators for controlling the coupling coefficient thereof专利检索，专利查询，专利分析的服务。并且Only part of the center of a ceramic body, such as a circular disc, is subjected to a polarizing voltage. In the case of a radial mode resonator this poled area may be a circular area in the center of the major faces of the resonator. This polling is accomplished by using temporary electrodes, which may or may not become part of the final electrode structure. After the element has been thus poled, a new or added electrode is applied to the resonator. This electrode is greater in area than the area of the poling electrode, and can be placed immediately over the poling electrodes, while still making electrical contact to the adjacent area of the ceramic body, or to the poling electrode, which in turn is in contact to the ceramic. By controlling the percentage area of the final electrode that is poled it is possible to decrease the separation of the resonant and anti-resonant frequencies of the piezoelectric resonator, thereby decreasing the coupling factor of the element.，下面是Method of manufacturing piezoelectric resonators for controlling the coupling coefficient thereof专利的具体信息内容。

权利要求

1. In the manufacture of a piezoelectric resonator consisting of a wafer of piezoelectric material of substantially uniform thickness between two opposite main surfaces, and that is to be provided with an electrode on each of said surfaces for connection to an external circuit to impress an electric field on said wafer, between such electrodes, the method of treating and assembling said wafer to conTrol the coupling factor and thereby the sharpness of resonance of the resonator in subsequent service when energized from such external circuit, which method consists in polarizing a centralized region of said wafer between said opposite surfaces to establish two centralized areas of opposite polarities on said opposite surfaces and a peripheral unpolarized thickness region around said centralized polar areas, and in applying electrodes to said opposite surfaces to be in electromechanical relation to said surfaces over areas respectively including and exceeding the respective polarized surface areas of said centralized region.

2. In the manufacture of piezoelectric resonator in which individual pieozelectric bodies of chemically prepared materials are derived from different batches or from batches suseptible to variations, due to variations in preparation or in chemical or thermal treatment, the method of treating each such body, to compensate for any such variations that may exist between samples, from the same batch or from different batches, in order to control the electro-mechanical coupling factor, that might exist between each such body and a pair of coupling electrodes to be subsequently applied thereto, for the ultimate purpose of controlling the resonance response of the ultimate electroded body to an applied electric field, which method of treating such body consists of: polarizing a centralized region of said individual bodies between said opposite surfaces to establish two centralized areas of opposite polarities on said opposite surfaces and a peripheral unpolarized thickness region around said centralized polar areas, and in applying electrodes to said opposite surfaces to be in electro-mechanical relation to said surfaces over areas respectively including and exceeding the respective polarized surface areas of said centralized region.

3. In the manufacture of a piezoelectric resonator embodying a plate of vibratable piezoelectric crystal material to be disposed as a dielectric between two planar electrodes to be electrically excited from an external circuit, which plate has both a natural resonance frequency and a natural antiresonance frequency; the method of reducing the frequency band-width of operation of the crystal plate, which method consists in polarizing a centralized region of said wafer between opposite surfaces of said plate of vibratable piezoelectric crystal material to establish two centralized areas of opposite polarities on said opposite surfaces and a peripheral unpolarized thickness region around said centralized polar areas, and in applying planar electrodes to said opposite surfaces to be in electro-mechanical relation to said surfaces over areas respectively including and exceeding the respective polarized surface areas of said centralized region.

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Method of manufacturing piezoelectric resonators for controlling the coupling coefficient thereof

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