专利汇可以提供IMAGE SENSOR PIXELS WITH JUNCTION GATE PHOTODIODES专利检索,专利查询,专利分析的服务。并且Image sensor pixels are provided having junction gate photodiodes. A group of pixels may have a shared floating diffusion region and a shared source-follower transistor. The source-follower transistor may be a JFET source-follower with a gate that forms the floating diffusion region. The JFET source-follower may be a vertical or lateral JFET. A reset diode may be forward-biased to reset the floating diffusion region. Each pixel may have a JFET that serves as a charge transfer barrier between the junction gate photodiode and the floating diffusion region. The charge transfer barrier JFET may be a lateral JFET. The image sensor pixels may be formed without any metal-oxide-semiconductor devices.,下面是IMAGE SENSOR PIXELS WITH JUNCTION GATE PHOTODIODES专利的具体信息内容。
What is claimed is:
This application claims the benefit of provisional patent application No. 61/557,640, filed Nov. 8, 2011, which is hereby incorporated by reference herein in its entirety.
This invention relates generally to image sensors, and more particularly, to back-side illuminated (BSI) image sensors.
Typical image sensors sense light by converting impinging photons into electrons that are integrated (collected) in sensor pixels. After completion of an integration cycle, collected charge is converted into a voltage, which is supplied to output terminals of the sensor.
For active pixel image sensors, charge-to-voltage conversion is performed in the pixels themselves. Pixel signals can be transferred as analog signals from individual pixels to output terminals of the image sensor. Alternatively, an analog pixel signal can be converted into a digital signal before it is transferred to the output terminals of the image sensor.
Various pixel addressing and scanning schemes can be used to transfer pixel signals from the individual pixels to the image sensor output terminals. Typically, each pixel has a buffer amplifier, such as a source follower (SF) transistor, which can drive sense lines that are connected to the pixels by suitable addressing transistors.
After pixel signals have been transferred out from the pixels, the pixels are reset in order to be ready for the accumulation of new charge. In pixels that have floating diffusion (FD) nodes that serve as charge detection nodes, the reset can be accomplished by momentarily turning on a reset transistor that conductively connects the floating diffusion node to a reference voltage supply, which is typically a pixel drain node. Resetting a pixel removes collected charge in the floating diffusion node of the pixel.
However, pixel reset may be accompanied by noise called reset noise, also known as kTC noise. Techniques such as correlated double sampling (CDS) signal processing techniques are used to reduce kTC noise in the signal. Typical active pixel sensors that utilize CDS signal processing techniques usually have three transistors per pixel (3T pixels) or 4 transistors per pixel (4T pixels). Some of the pixel transistors can be shared amongst several pixels.
A cross-sectional view of a conventional pixel 100 is shown in
Pixel 100 has a transfer gate 110 that receives transfer signal Tx. Transfer gate Tx 110 is formed from doped polysilicon. An oxide layer 109 isolates transfer gate 110 from epitaxial layer 115. A masking oxide 111 is formed over transfer gate 110 that serves as a patterning hard mask as well as an additional blocking mask for ion plantation. Sidewall spacers 116 can help to control mutual edge positions of p+ type layer 107 and n-type region 108. Floating diffusion 104 is formed in p-well 103 and receives charge signal from PD.
P+ type regions 105 and 106 provide isolation between pixels and can be connected to ground GND. Inter-level (IL) oxide layers are used for isolation of multi-level metal wiring and interconnect. Metal vias 114 in contact holes 113 connect pixel active circuit components such as isolation regions 105 and 106, transfer gate 110, and floating diffusion 104 to metal wiring.
Transfer gate Tx 110, having a length as marked by arrows 98, occupies a large portion of valuable area of pixel 100. Transistors such as a source-follower (SF) transistor, reset transistor, and addressing transistor, while not shown in
It would be desirable to have improved pixel circuits that are having less transistor gate surface area in order to maximize pixel area that is used for charge storage, thereby increasing the pixel charge storage capacity.
It is desirable to integrate pixel circuit components into single structures, preferably in a vertical direction, in order maximize pixel area occupied by the photodiode and thus maximize charge storage capacity. It is also desirable to share pixel circuit components amongst several photodiodes.
A junction gate photodiode is provided. The junction gate photodiode may be fabricated by self-aligned processing steps. The junction gate photodiode may have a source-follower transistor and a floating diffusion region integrated together into one structure. The integrated floating diffusion and source-follower transistor structure may not need a contact via to the floating diffusion. The integrated structure may be oriented in a vertical or lateral direction. Pixel reset may be accomplished with a vertically oriented diode rather than a metal-oxide-semiconductor (MOS) transistor. A junction gate photodiode pixel may be provided that does not have any MOS transistors. A junction gate photodiode pixel that does not have MOS gate structures may have increased sensor reliability, particularly at high temperatures, reduced dark current effects, and reduced random telegraph signal (RTS) noise. Pixel radiation hardness may also be increased, particularly for ionizing radiation.
An illustrative circuit diagram of pixels having junction gate photodiodes is shown in
Each pixel 20 may have a photodiode such as junction gate photodiode 220. Junction gate photodiode 220 may have junction gate (JG) diode 204 and photodiode (PD) 203. Junction gate diode 204 may have a gate region that is n+ type. The gate region of junction gate diode 204 may be connected to transfer signal line 205. The gate region of junction gate diode 204 may be known as a junction gate. Incident light on photodiode 203 may generate charge. Photodiode 203 and junction gate diode 204 may form a node 211, which may serve as a potential well for storing photo-generated charge. Node 211 may be known as a charge storage well.
Junction gate diode 204 may be connected to line 205 which receives transfer signal Tx. Each pixel 20 may have a JFET 202 connected to node 211. JFET 202 may be a lateral n-channel JFET having a gate connected to ground terminal 210. JFET 202 may form a charge transfer barrier between charge storage node 211 and a shared floating diffusion node 208 that is shared amongst pixels 20 in pixel circuit 200.
Pixel circuit 200 of
Floating diffusion node 208 may be reset with a diode such as reset diode 206. Reset diode 206 may be connected to a reset line 207. When reset line 207 is driven high, diode 206 is forward-biased and floating diffusion node 208 may be reset to a reset voltage. After floating diffusion node 208 is reset, reset line 207 is driven low, reverse-biasing diode 206. Floating diffusion node 208 is then able to receive and hold photo-generated charge.
During an integration period, junction gate diode 204 is reverse-biased by a high voltage on addressing line 205. Photodiodes 203 generate photo-generated charge from incident light and the photo-generated charge is stored at node 211. The photo-generated charge is separated by a barrier formed by JFET 202 from floating diffusion node 208.
Following the integration period, addressing lines 205 are pulsed low, which transfers photo-generated charge from node 211 to floating diffusion node 208. The transfer of photo-generated charge from node 211 to floating diffusion node 208 may occur sequentially for pixels 20 in pixel circuit 200.
The photo-generated charge on floating diffusion node 208 changes the source voltage of the source-follower JFET that may be sampled after charge transfer from each one of pixels 20. After each sensing, node 208 may be reset. Alternatively, photo-generated charge from one, two, three, or four pixels 20 may be summed on floating diffusion node 208 before floating diffusion node 208 is reset. Source-follower JFET 201 may output a signal voltage Vout to column line 209. Sampled charge may be stored in reference storage place of a correlated double sampling (CDS) circuit.
In the example of
An illustrative layout topology for pixel circuit 200 is shown in
A 4-shared pixel layout is shown in
A cross-sectional view through line A-A′ of
As shown in
Layers 402 may be temporary layers that define future active device regions. Layers 402 may be formed from polysilicon or other suitable materials. Sidewall oxide spacers 404 may be formed at the edges of polysilicon regions 402. P+ type doped pinning implants 408 in substrate 401 may have sizes that are defined by sidewall oxide spacers 404.
P+ type doped pinning implant 408 and n-type doped layer 406 may form a photodiode such as photodiode 203 in
As shown in
As shown in
As shown in
In the example of
A potential barrier in a region under n+ type junction gate 413 may be adjusted by a suitable p-type doping level such that overflow charge from the potential well located under n+ type junction gate 413 flows vertically into n+ type junction gate 413, preventing blooming into neighboring pixels.
As shown in
As shown in
The n+ doped junction gate region 620 may be covered by a thin metal layer 619 that can be used later in the processing to form self-aligned metal silicide. Suitable metals for metal layer 619 may include titanium, tungsten, or nickel. The metal silicide act as a mirror on top of the photodiode that reflects the light that has not been fully absorbed in the silicon bulk when the device is illuminated from the back side. This improves quantum efficiency. Silicide thickness can be thin and provides an easier contact to metal via 622. Metal layer 619 is optional and may also be used in the example of
Junction diode pixels in the examples of
Junction gate photodiode pixels in the examples of
Various embodiments have been described illustrating image sensor pixels that are having junction gate photodiodes. A group of pixels may have a shared floating diffusion region and a shared source-follower transistor. The shared source-follower transistor may be a JFET source-follower with a gate that forms the floating diffusion region. The JFET source-follower may be a vertical or lateral JFET. A shared reset diode may be connected to the shared floating diffusion region. The reset diode may be forward-biased to reset the floating diffusion region. A group of pixels sharing pixel circuitry may be a group of four pixels, eight pixels, or any suitable number of pixels.
Each pixel may have a JFET that serves as a charge transfer barrier between the junction gate photodiode and the shared floating diffusion region. The charge transfer barrier JFET may be a lateral JFET. The charge transfer barrier JFET may have a gate connected to a ground. Incident light may generate charge that is stored in a charge storage node in the junction gate photodiode. A transfer signal on a transfer signal line connected to the junction gate photodiode may be pulsed to transfer charge from the charge storage node to the shared floating diffusion region. The shared floating diffusion region may receive and reset charge from one pixel before receiving charge from a second pixel. Alternately, the floating diffusion region may receive and sum charge signals from multiple pixels.
The image sensor pixels may be formed without any metal-oxide-semiconductor devices.
The foregoing is merely illustrative of the principles of this invention which can be practiced in other embodiments.
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