Manfacture of semiconductor device
专利汇可以提供Manfacture of semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE: To prevent peeling of superposed adhesive tapes therebetween, by making one adhesive tape with adhesive layers on both surfaces be stuck on the other adhesive tape with the adhesive layer on one surface and sticking a semiconductor device substrate on the former adhesive tape and performing a dividing process for the device.
CONSTITUTION: An adhesive tape 4 with adhesive layers 3 and 3' on both surfaces is stuck on an adhesive tape 2 with and adhesive layer 1 on one surface, and a light-emitting diode array substrate 5, on which many light-emitting- diode elements are formed, is stuck on the adhesive layer 3'. Next, this semiconductor element is grooved by a normal dicing method so that a thickness 6 of the adhesive tape 4 remaining on the adhesive layer 3 is 20μm so as to form a cut groove 7. Then, the light-emitting-diode array substrate 5 is diced lengthwise and sidewise and divided into individual device, and next the adhesive tapes 2 and 4 are expanded 1.5 times as large as in an initial term so as to enlarge distances between the devices and to fix the adhesive tapes with a jig. Hence, no peeling occurs between these superposed adhesive tapes, and device appearance checks in post-processes could have been facilitated.
COPYRIGHT: (C)1988,JPO&Japio，下面是Manfacture of semiconductor device专利的具体信息内容。
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