Package structure of saw device or the like
专利汇可以提供Package structure of saw device or the like专利检索，专利查询，专利分析的服务。并且PURPOSE:To eliminate a short circuit between inter-digital transistor IDT electrode fingers, and to raise the yield by providing a minute gap from the surface, on the surface of an SW device which has completed a connection to a lead, fixing a plate of glass, etc., and separating the surface of the device and the inside surface of a sealing cover. CONSTITUTION:An SAW device 2 is fixed onto a base 1 by an adhesive agent 5, leads 3, 3 passing through airtightly the base 1 and an IDT electrode formed on the surface of the 2 are connected by bonding wires 6, 6, and thereafter or theretofore, a glass plate 8 is stuck onto a piezoelectric substrate of the device 2 through adhesive agents 7, 7. Subsequently, the device 2 is sealed up tightly by using a sealing cover 4. According to this tructure, a gap between the device 2 and the glass plate 8 is minute, therefore, even if metallic fine particles adhering to the inside surface of the sealing cover 4 drop after packaging has been ended, there is no possibility that it adheres onto the IDT electrode.，下面是Package structure of saw device or the like专利的具体信息内容。
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