Manufacture of semiconductor device
专利汇可以提供Manufacture of semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE:To otain a thin-type device having high mounting density by burying semiconductor elements into a substrate, forming a circuit forming surface in the same plane as the substrate mutually connecting the semiconductor elements. CONSTITUTION:An adhesive tape 3 is stuck to one surface of a substrate 1 to close one end of a through-hole 2, and a semiconductor element 4 is inserted from a circuit forming surface, and fixed temporarily by adhesives 5 on the tape 3. The thickness of the element 4 is slightly thinner than the substrate 1. A resin 6 is injected so as to coincide with the surface of the substrate 1, and cured, and the tape 3 is peeled to expose the circuit forming surface 7 in the element 4. The substrate 1 is wired or the element 4 is connected to other buried semiconductor elements by wirings 8. According to the constitution, wirings 8 are facilitated because there is no stepped section, and mounting density can be increased remarkably because there is no mechanical limitation such as wire joining.，下面是Manufacture of semiconductor device专利的具体信息内容。
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