Semiconductor device
专利汇可以提供Semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE:To obtain a favorably heat-radiant semiconductor device by a method wherein a hole to put the semiconductor device in it is provided at the center part of a resin substrate, a plate having a favorable thermal conductivity is adhered closely to the lower face of the substrate and the semiconductor integrated circuit is fixed on the plate in the hole of the resin substrate. CONSTITUTION:The hole 13 larger than the semiconductor integrated circuit 6 is provided at the center part of the resin substrate 8 being provided with lead wires 9. The heat radiating plate 7 is adhered to the lower face of the substrate, and the semiconductor integrated circuit 6 is fixed on the plate 7 in the hole of the resin substrate. The semiconductor integrated circuit and the lead wires are connected with fine wires 10, and is sealed with an epoxy resin 11. By this way, the favorably heat radiant semiconductor device being able to package the semiconductor integrated circuit having a large power consumption can be obtained keeping the merit of the small and thin chip carrier type in that condition.，下面是Semiconductor device专利的具体信息内容。
| 标题 | 发布/更新时间 | 阅读量 |
|---|---|---|
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| 一种双足机器人电机驱动系统和智能温度保护方法 | 2020-05-11 | 760 |
| 一种防眩光触摸屏 | 2020-05-11 | 854 |
| 一种具有按键的门禁设备 | 2020-05-12 | 942 |
| 智能功率模块、智能功率模块的制作设备及空调器 | 2020-05-12 | 223 |
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