Integrated circuit package
专利汇可以提供Integrated circuit package专利检索，专利查询，专利分析的服务。并且PURPOSE: To obtain faulty action-free IC package for super-high speed operation by short-circuiting input signal terminal and end earthing terminal with the assistance of conductive pattern on the ceramic substrate.
CONSTITUTION: MoMn pattern 12 is created on the ceramic substrate 11 with copal lead terminal 13 bonded at one end. The pattern 12 and terminal 13 are plated with gold. Input signal terminal 13 and an adjacent terminal 13" are connected by means of the pattern 12. Next, IC chip 4 is installed and wire-connected as prearranged, and is sealed with a ceramic cap. After this procedure, if an input signal line is connected to the terminal 13 and terminal 13" is connected to an earthing line through terminal resistance with a connection line, an input signal pulse in the super-high speed logical circuit is absorbed by the terminal resistance. Thus faulty action due to reflection is prevented and a package of high reliability is obtained.
COPYRIGHT: (C)1980,JPO&Japio，下面是Integrated circuit package专利的具体信息内容。
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