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标题 发布/更新时间 阅读量
SEMICONDUCTOR MEMORY DEVICES FOR USE IN ELECTRICALLY ALTERABLE READ ONLY MEMORY (ROM) AND SEMICONDUCTOR THIN FILM DEVICES (SPINTRONS and SPIN-ORBITRONS) 2024-02-25 567
SELECTOR DEVICE FOR A NON-VOLATILE MEMORY CELL 2024-02-14 863
CHIP PACKAGE AND METHOD FOR FORMING THE SAME 2024-02-12 156
Implant Isolated Devices and Method for Forming the Same 2024-02-21 755
SLOPED FINFET WITH METHODS OF FORMING SAME 2024-02-17 416
DRAIN SELECT GATE FORMATION METHODS AND APPARATUS 2024-02-19 812
COAXIAL CARBON NANOTUBE CAPACITOR FOR eDRAM 2024-02-26 32
BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) 2024-02-24 20
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PROCESS 2024-02-10 648
ORGANIC LIGHTING EMITTING DISPLAY DEVICE INCLUDING LIGHT ABSORBING LAYER AND METHOD FOR MANUFACTURING SAME 2024-02-11 56
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 2024-02-15 760
FLASH MEMORY SEMICONDUCTOR DEVICE 2024-02-20 140
SEMICONDUCTOR PACKAGE USING A CORELESS SIGNAL DISTRIBUTION STRUCTURE 2024-02-22 968
SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME 2024-02-23 566
INTEGRATED DEVICE PACKAGE COMPRISING A MAGNETIC CORE INDUCTOR WITH PROTECTIVE RING EMBEDDED IN A PACKAGE SUBSTRATE 2024-02-29 944
Multi-Band Antenna with a Battery Resonator 2024-02-13 45
L-SHAPED CAPACITOR IN THIN FILM STORAGE TECHNOLOGY 2024-02-18 57
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF 2024-02-27 903
III GROUP NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 2024-02-16 457
Integrated Circuit Having a MOM Capacitor and Method of Making Same 2024-02-28 900
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