RESIN COMPOSITION AND HEAT-RESISTANT ADHESIVE |
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| 申请号 | PCT/JP2007058575 | 申请日 | 2007-04-13 | 公开(公告)号 | WO2007119884A9 | 公开(公告)日 | 2008-04-03 |
| 申请人 | OTSUKA CHEMICAL CO LTD; KAWANO KAZUHIRO; | 发明人 | KAWANO KAZUHIRO; | ||||
| 摘要 | Disclosed is a resin composition containing a copolymer which is obtained by copolymerizing 80-99.9 parts by weight of a vinyl monomer mainly containing a (meth)acrylic acid alkyl ester and 0.1-20 parts by weight of a vinyl monomer having a reactive functional group by living radical polymerization, while using, as a polymerization initiator, one of the following: (a) an organic tellurium compound represented by the formula (1) below; (b) a mixture of an organic tellurium compound represented by the formula (1) below and an azo polymerization initiator; (c) a mixture of an organic tellurium compound represented by the formula (1) below and an organic ditellurium compound represented by the formula (2) below; and (d) a mixture of an organic tellurium compound represented by the formula (1) below, an azo polymerization initiator and an organic ditellurium compound represented by the formula (2) below. The resin composition is characterized in that the metal content in the composition is not more than 1000 ppm. (1) (In the formula, R 1 represents a C 1 -C 8 alkyl group, an aryl group, a substituted aryl group or an aromatic heterocyclic group; R 2 and R 3 respectively represent a hydrogen atom or a C 1 -C 8 alkyl group; and R 4 represents an aryl group, a substituted aryl group, an aromatic heterocyclic group, an acyl group, an amide group, an oxycarbonyl group or a cyano group.) (R 1 Te) 2 (2) (In the formula, R 1 is as defined above.) | ||||||
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