Board, semiconductor fabrication plant (FAB) and fabrication facility |
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| 申请号 | US15017559 | 申请日 | 2016-02-05 | 公开(公告)号 | US10104816B2 | 公开(公告)日 | 2018-10-16 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.; | 发明人 | Chwen Yu; Chih-Ming Tsao; | ||||
| 摘要 | A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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