SENSING STRUCTURE OF ALIGNMENT OF A PROBE FOR TESTING INTEGRATED CIRCUITS |
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申请号 | US15848996 | 申请日 | 2017-12-20 | 公开(公告)号 | US20180113168A1 | 公开(公告)日 | 2018-04-26 |
申请人 | STMicroelectronics S.r.l.; | 发明人 | Alberto Pagani; | ||||
摘要 | A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential. | ||||||
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