Method for forming adhesion surface of covering metal with object for adhesion |
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| 申请号 | JP15385388 | 申请日 | 1988-06-22 | 公开(公告)号 | JPH01320053A | 公开(公告)日 | 1989-12-26 |
| 申请人 | Tokuriki Shoten:Goushi; | 发明人 | ONO HIROKI; | ||||
| 摘要 | PURPOSE: To form excellent adhesion interface with cement or adhesive resin by coating liquid gallium alloy over the surface of covering metal. CONSTITUTION: A pure tin rod is covered with a liquid Ga-Sn alloy, for ex. Ga-Sn alloy having a liquid phase point of 20°C and rubbed onto the surface of a covering metal, and now a new alloy layer incl. Ga-Sn is formed on the surface of this covering metal. This process is applied to these alloys with scarce bond force in adhesive resin according to conventional knowledge, and the bond property is measured by a tensile test, which has demonstrated a bond strength exceeding 450kgf/cm 2 with Au/Ag paradium alloy. An examination of the water resistance in an adhesion interface after dipping underwater has revealed that no exfoliation is observed at the interface and the water resistance is very high. On the other hand, application of this process to adhesion of Au alloy with polycarboxylate cement has exhibited a bond strength of 130kgf/cm 2 as measured by tensile test. COPYRIGHT: (C)1989,JPO&Japio |
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