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Production of substrate for carrying components

阅读:313发布:2023-03-14

专利汇可以提供Production of substrate for carrying components专利检索,专利查询,专利分析的服务。并且PURPOSE:To make a thinner substrate with an improved heat radiation of components carried by connecting a wiring pattern provided on an insulator layer to components fastened in a recess which is formed on a metal substrate with the insulator layer as mask privided on one main surface of substrate. CONSTITUTION:A highly insulating sheet 36 such as polyamide imide punched in a device hole section 34 is stuck on a metal plate 33 made of Al, Cu or the like under a heat and pressure. Then, with the sheet 36 as mask, the metal plate 33 is etched to form a device hole 34. A wiring pattern 38 is formed on the surface of the sheet 36 by an ordinary method. Then, a device 39 is housed in the device hole 34 in such a manner that the surface thereof is kept below the surface of the hole and soldered for example. Then, the electrode section of the device 39 is connected to the wiring pattern 38, for example, by wire-bonding of a lead 40. The substrate can be made thinner with an improved heat radiation. The use of the insulating sheet 36 able to be overhung prevents short-circuiting of the lead 40.,下面是Production of substrate for carrying components专利的具体信息内容。

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