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Tape carrier for semiconductor

阅读:453发布:2023-03-10

专利汇可以提供Tape carrier for semiconductor专利检索,专利查询,专利分析的服务。并且PURPOSE:To remove a bridge in the case when assembling a semiconductor device by forming at least two layers or more of lead or a solder layer, the main body thereof is lead, and tin or a solder layer, the main body thereof is tin, onto the tape carrier shaped by bonding copper or copper alloy foil onto a film through an electroplating method and forming the uppermost layer in the solder layer of tin. CONSTITUTION:The tape carrier is manufactured in such a manner that the pattern-shaped copper or copper alloy foil 2 is pasted onto the heatproof plastic film 1 by using adhesives 3. The copper or copper alloy foil 2 is coated with the solder layers 4 consisting of pure lead through the electroplating method, and the layers 4 are coated similarly with the solder layers 5 of pure tin formed through the electroplating method. Accordingly, at least two layers or more of the solder layers are shaped, and the solder layer of tin is exposed to the surface under the last condition. Lead as the composition of the whole solder layers is 80-98wt% here. Consequently, wetting property with a semiconductor element is improved, and the bridges are not generated among patterns.,下面是Tape carrier for semiconductor专利的具体信息内容。

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