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Manufacturing of carrier tape useful for ic

阅读:403发布:2023-03-21

专利汇可以提供Manufacturing of carrier tape useful for ic专利检索,专利查询,专利分析的服务。并且PURPOSE: To provide a novel carrier tape in which the conductor pattern-forming areas and foil-preserving areas on the upper surface of a conductor foil and the bump-forming areas and foil-preserving areas on the back surface of the same conductor foil are covered with resist; only the upper surface is etched to half depth, while exposed areas are etched off, so that bumps are intergrally formed on the side opposite to the patterns.
CONSTITUTION: Conductor foil tape 1 is coated with photoresist 3. Patterns are sticked on the coated surface, followed by development. From the upper surface of foil 1, resist 4 corresponding to the area where the pattern would not be formed within a device hole is removed, while from the back surface of foil 1, resist 5 corresponding to the area where the bump would not be formed within the device hole is removed. Then both the upper and the back of the tape are subjected to suimultaneous ething, producing an ethed area 8 having a thickness necessary for the formation of bumps. Thus a bump-forming area 6 and the exterion of the device hole 9 have the same thickness as foil 1. All resists remaining unremoved are then peeled off. The resultant composite is tin-plated to finish a film-less and bump- provided IC carrier tape, which, having no organic films to cover but having excellent electrical and mechanical properties, is highly resistant to heat.
COPYRIGHT: (C)1980,JPO&Japio,下面是Manufacturing of carrier tape useful for ic专利的具体信息内容。

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