Die-bonding device
专利汇可以提供Die-bonding device专利检索，专利查询，专利分析的服务。并且PURPOSE: To easily make the exact positioning by doing the decision of inspecting positioning based on over-all information in which an optical image is focused and scanned on the photoelectric conversion surface on which the photoelectric conversion elements are arranged in matrix condition in a die-bonding device at the manufacture of a semiconductor device.
CONSTITUTION: The light emanated from a lamp 21 applied to several semiconductor pellets 9 and boundary detection mark 12 which are sticked on a transparent sheet 10 through a convex lens 22, a half mirror 23, object lenses 24a, 24b. The image is focused on a focal surface S by an optical system 2 which consists of the object lenses 24a, 24b, the half mirror 23, and a focus lens 25. The focal surface S installs a solid image sensor 26 on which several microscopic photoelectric conversing elements are arranged in matrix shape in the direction of an X axis and a Y axis and scanning and detection are made by a scanning pulse SP from a detection circuit 27 and a response pulse OP is detected and sent out after converting into a detection pulse KP.
COPYRIGHT: (C)1980,JPO&Japio，下面是Die-bonding device专利的具体信息内容。
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