Semiconductor device
专利汇可以提供Semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE: To facilitate the resin sealing and to minimize the size of the device with a high heat dissipation property secured through the reduced thickness of the device by giving the lower height to the basement part of the device than the whole part of the inslated substrate and then giving the resin sealing to the heat absorbing conductor, the semiconductor substrate and the lead each.
CONSTITUTION: Electrode 8C on one surface of semiconductor substrate 8 is stuck to heat absorbing conductor 1 containing external electrode lead 2, and other external lead 4 and 5 are stuck to conductor 1 via insulated substrate 3. Then internal lead 9 and 10 connect between lead 4/5 and electrode 8a/8b on the other surface of substrate 8. In this case, the height of the basement of substrate 8 is set less than the overall height of substrate 3, and at the same time resin sealing 11 is applied to conductor 1, substrate 8, substrate 3 plus part of external electrode lead 6 and 7 as well as the peripheral surfaces of lead 9 and 10. In this way, the resin sealing can be performed in a simple way, and then the size of the device can be minimized with a high heat dissipation property secured by reducing the thickness of the device.
COPYRIGHT: (C)1979,JPO&Japio，下面是Semiconductor device专利的具体信息内容。
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