Multilayer printed circuit board device
专利汇可以提供Multilayer printed circuit board device专利检索，专利查询，专利分析的服务。并且PURPOSE: To form a multilayer and obtain a highly reliable wiring device which is able to withstand deterioration due to aging, by sticking second boards where void spaces are formed at the same positions on the sides of a first board and embedding circuit parts in the void spaces, and connecting them by a through hole connecting part.
CONSTITUTION: Wiring conductors 31 and 32 are formed on one side of a board, and second boards 12 and 13 where void spaces 16 are formed to mount chip parts 14 and 14' are sticked to the prescribed positions of both sides of the first board 11. A hole 23 where internal walls are connected by conductors 26A, and the wiring conductors 31 and 32 are connected with the wiring conductors 21 and 22, making up multilayer through hole connecting parts 26 which extending over three layers. A plurality of chip parts 14 and 14' are mounted in the void spaces and they are embedded in such a way that the formation plane of each electrode pad 14a and the outer face of an electrode party 14'a are in the same level. In this way, a multilayer formation process is simplified and circuit component parts can be mounted on both sides of the board as well. This approach improves the reliability for the formation of a multilayered board and for the deterioration of multilayer devices due to aging.
COPYRIGHT: (C)1989,JPO&Japio，下面是Multilayer printed circuit board device专利的具体信息内容。
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